Title :
Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)
Abstract :
The following topics were dealt with: flip-chip technology; adhesion; viscoelastic properties; isotropically conductive adhesives; package technologies; reliability; interconnection technologies; underfill; and test techniques
Keywords :
adhesion; electronic equipment manufacture; electronic equipment testing; flip-chip devices; packaging; reliability; adhesion; flip-chip technology; interconnection technologies; isotropically conductive adhesives; package technologies; reliability; test techniques; underfill; viscoelastic properties;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY, USA
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.741995
