Title :
A novel method for fast identification of peak current during test
Author :
Zhao, Wei ; Chakravarty, Sreejit ; Ma, Junxia ; Devta-Prasanna, Narendra ; Yang, Fan ; Tehranipoor, Mohammad
Author_Institution :
ECE Dept., Univ. of Connecticut, Storrs, CT, USA
Abstract :
Existing commercial power sign-off tools analyze the functional mode of operation for a small time window. The detailed analysis used makes such tools impractical in determining test peak power where a large amount of scan shift cycles have to be analyzed. This paper proposes an approximate test peak power analysis flow capable of computing test peak power at each power bump in the design. The flow uses physical design information, like power grid, power bump location, packaging information, along with the design netlist. We present correlation studies, on industrial design, and show the proposed flow to correlate within 5%of the accurate commercial power sign-off tool. In addition, we demonstrate that this flow, unlike the commercial power sign-off tool, can process a very large number of transition delay tests in a reasonable time.
Keywords :
VLSI; electronics packaging; integrated circuit testing; power grids; power integrated circuits; commercial power sign-off tools; design netlist; fast identification; packaging information; peak current; physical design information; power bump location; power grid; small time window; Analytical models; Industries; Monitoring; Power grids; Power system dynamics; Rails; Standards; Test power; peak current; power bump; power grid; weighted switching activity;
Conference_Titel :
VLSI Test Symposium (VTS), 2012 IEEE 30th
Conference_Location :
Hyatt Maui, HI
Print_ISBN :
978-1-4673-1073-4
DOI :
10.1109/VTS.2012.6231101