Fracture behaviour of isotropically conductive adhesives

Author

Gupta, S. ; Hydro, R.M. ; Pearson, R.A.

Author_Institution

Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA

fYear

1998

fDate

28-30 Sep 1998

Firstpage

38

Lastpage

43

Abstract

Adhesion at a polymer metal interface is a complex phenomenon that is still not well understood. Several mechanisms for adhesion have been proposed including mechanical interlocking, chemical forces, and electrical forces. The objective of this investigation is to deepen our understanding of the adhesive strength of silver-filled, epoxy-based adhesives bonded to typical lead frame surfaces such as copper. Specifically, we are interested in the interplay of intrinsic and extrinsic energy dissipation mechanisms

Keywords

adhesion; adhesives; conducting polymers; filled polymers; fracture; fracture toughness; integrated circuit bonding; integrated circuit packaging; microassembling; particle reinforced composites; silver; Ag; Cu; Cu lead frame surface; adhesion mechanisms; adhesive strength; chemical forces; electrical forces; extrinsic energy dissipation mechanisms; fracture behaviour; intrinsic energy dissipation mechanisms; isotropically conductive adhesives; lead frame surfaces; mechanical interlocking; polymer-metal interface adhesion; silver-filled epoxy-based adhesives; Adhesive strength; Conductive adhesives; Copper; Energy dissipation; Goniometers; Polymers; Probes; Strips; Surface cracks; Thermodynamics;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.742000

Filename

742000