Title :
Fracture behaviour of isotropically conductive adhesives
Author :
Gupta, S. ; Hydro, R.M. ; Pearson, R.A.
Author_Institution :
Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA
Abstract :
Adhesion at a polymer metal interface is a complex phenomenon that is still not well understood. Several mechanisms for adhesion have been proposed including mechanical interlocking, chemical forces, and electrical forces. The objective of this investigation is to deepen our understanding of the adhesive strength of silver-filled, epoxy-based adhesives bonded to typical lead frame surfaces such as copper. Specifically, we are interested in the interplay of intrinsic and extrinsic energy dissipation mechanisms
Keywords :
adhesion; adhesives; conducting polymers; filled polymers; fracture; fracture toughness; integrated circuit bonding; integrated circuit packaging; microassembling; particle reinforced composites; silver; Ag; Cu; Cu lead frame surface; adhesion mechanisms; adhesive strength; chemical forces; electrical forces; extrinsic energy dissipation mechanisms; fracture behaviour; intrinsic energy dissipation mechanisms; isotropically conductive adhesives; lead frame surfaces; mechanical interlocking; polymer-metal interface adhesion; silver-filled epoxy-based adhesives; Adhesive strength; Conductive adhesives; Copper; Energy dissipation; Goniometers; Polymers; Probes; Strips; Surface cracks; Thermodynamics;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742000
