Chemical kinetic model of interfacial degradation of adhesive joints

Author

Lam, David C C ; Yang, Fan ; Tong, Pin

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong

fYear

1998

fDate

28-30 Sep 1998

Firstpage

44

Lastpage

48

Abstract

The mechanical properties of adhesive joints are degraded in the presence of water. The progressive decrease in strength has been attributed to propagation of interfacial cracks. Water diffusion and the stress distribution within the joint as a function of time are modeled using the finite element method in this study. The stress history at the interface showed spatially invariant characteristics similar to that of interfacial water concentration history as a function of diffusion. The water-stress history along the interface can be modeled as a function dependent principally on water concentration, and is independent of position. On this basis, a chemical kinetic model is proposed to explain the joint strength degradation data reported in literature

Keywords

adhesives; circuit reliability; cracks; failure analysis; finite element analysis; interface phenomena; internal stresses; mechanical strength; moisture; packaging; reaction kinetics; stress analysis; surface chemistry; adhesive joint model; adhesive joints; chemical kinetic model; finite element method; interface stress history; interface water-stress history; interfacial crack propagation; interfacial degradation; interfacial water concentration history; joint strength degradation; mechanical properties; mechanical strength; spatially invariant stress characteristics; stress distribution; water concentration; water degradation; water diffusion; Chemicals; Curing; Degradation; Finite element methods; History; Kinetic theory; Polymers; Residual stresses; Thermal stresses; Water;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.742001

Filename

742001