Title :
Chemical kinetic model of interfacial degradation of adhesive joints
Author :
Lam, David C C ; Yang, Fan ; Tong, Pin
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
Abstract :
The mechanical properties of adhesive joints are degraded in the presence of water. The progressive decrease in strength has been attributed to propagation of interfacial cracks. Water diffusion and the stress distribution within the joint as a function of time are modeled using the finite element method in this study. The stress history at the interface showed spatially invariant characteristics similar to that of interfacial water concentration history as a function of diffusion. The water-stress history along the interface can be modeled as a function dependent principally on water concentration, and is independent of position. On this basis, a chemical kinetic model is proposed to explain the joint strength degradation data reported in literature
Keywords :
adhesives; circuit reliability; cracks; failure analysis; finite element analysis; interface phenomena; internal stresses; mechanical strength; moisture; packaging; reaction kinetics; stress analysis; surface chemistry; adhesive joint model; adhesive joints; chemical kinetic model; finite element method; interface stress history; interface water-stress history; interfacial crack propagation; interfacial degradation; interfacial water concentration history; joint strength degradation; mechanical properties; mechanical strength; spatially invariant stress characteristics; stress distribution; water concentration; water degradation; water diffusion; Chemicals; Curing; Degradation; Finite element methods; History; Kinetic theory; Polymers; Residual stresses; Thermal stresses; Water;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742001
