Title :
Cyanate ester die attach material for radiation hardened electronic packages
Author :
Shah, Tushar ; Danziger, Steve ; Moores, Kevin ; Joshi, Yogendra
Author_Institution :
Lockheed Martin Fed. Syst., Manassas, VA, USA
Abstract :
Until recently, the choice of die attach materials in hermetic packaging for space applications has been limited to three types: silver-glass, gold-silicon eutectic, and polyimide film or paste. The performance of each die bond material varies with die size and actual package design, and no single material has given optimum performance for every type of packaging configuration. As a result, selection of the appropriate material has become a complicated procedure where production processes must be continuously modified to meet quality, reliability and performance goals. However, the use of solvent free, polymeric materials such as cyanate ester have great potential as universal die bond adhesives for single chip modules. Details of the qualification process for use of cyanate ester die attach material within radiation hardened memory modules is presented in this paper. A package was subjected to testing as per MIL STD 883E to assess the quality of the die bond, and the effect of cyanate ester on any other subsequent process steps. Based on the results obtained, cyanate ester has become the clear choice for the die attach material for all single chip modules at LMFS. Not only did it prove to be the superior die attach material in this case, it also provided additional benefits such as significantly reduced cycle times and overall manufacturing costs
Keywords :
adhesives; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated memory circuits; microassembling; modules; polymer films; quality control; radiation hardening (electronics); space vehicle electronics; Ag; AuSi; MIL STD 883E testing; cyanate ester; cyanate ester die attach material; cycle time; die attach material; die attach materials; die bond material; die bond quality; die size; gold-silicon eutectic die attach; hermetic packaging; manufacturing costs; material selection; optimum die bond performance; package; package design; packaging configuration; performance goals; polyimide film die attach; polyimide paste die attach; production processes; qualification process; quality goals; radiation hardened electronic packages; radiation hardened memory modules; reliability goals; silver-glass die attach; single chip modules; solvent-free polymeric materials; space applications; universal die bond adhesives; Bonding; Continuous production; Electronics packaging; Materials reliability; Microassembly; Polyimides; Polymers; Qualifications; Radiation hardening; Solvents;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742002