Title :
Visco-elastic-plastic behaviors of polymer-based packaging materials
Author :
Qian, Zhengfang ; Lu, Minfii ; Liu, Sheng
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
Abstract :
The viscoelastic and viscoplastic properties of polymer films, an underfill, and a molding compound are reported in this paper. The scale effect is also investigated preliminarily. A constitutive framework from viscoelasticity to viscoplasticity is then proposed to describe the deformation characteristics. The significance of the nonlinear characteristics of polymer films and filled polymers to the selection of adhesives and determination of adhesive strength is discussed
Keywords :
adhesives; deformation; encapsulation; filled polymers; flip-chip devices; integrated circuit packaging; integrated circuit testing; moulding; plastic packaging; polymer films; viscoelasticity; viscoplasticity; adhesive selection; adhesive strength; constitutive framework; deformation characteristics; filled polymers; molding compound; nonlinear characteristics; polymer films; polymer-based packaging materials; scale effect; underfill; visco-elastic-plastic behaviour; viscoelastic properties; viscoelasticity; viscoplastic properties; viscoplasticity; Adhesives; Conducting materials; Elasticity; Electronics packaging; Materials testing; Mechanical factors; Plastic integrated circuit packaging; Polymer films; Stress; Viscosity;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742004
