Title :
Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints
Author :
Constable, J.H. ; Kache, Thomas ; Teichmann, Heiko ; Mühle, Sven ; Gaynes, Michael A.
Author_Institution :
State Univ. of New York, Binghamton, NY, USA
Abstract :
Four isotropically conducting adhesives were used to form lap joints between copper fingers which had been prepared with four surface metallizations (Cu, Au, Pd, and PdNi). A micromechanical tester was used to perform pull and fatigue tests on the 16 adhesive/finish combinations. The micro-ohm resistance change was measured during both the pull and fatigue tests. The similarities and differences between the mechanical strength, fatigue life, and resistance change for the 16 adhesive/finish combinations are reported, and conclusions are drawn about relative motion between silver particles and the fracture interfaces
Keywords :
adhesives; conducting polymers; contact resistance; fatigue testing; filled polymers; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit testing; mechanical strength; mechanical testing; monitoring; Ag; Au surface metallization; Au-Cu; Cu; Cu surface metallization; Pd surface metallization; Pd-Cu; PdNi surface metallization; PdNi-Cu; adhesive/finish combinations; continuous electrical resistance monitoring; copper fingers; fatigue life; fatigue tests; fracture interfaces; isotropically conducting adhesives; isotropically conductive adhesive joints; lap joints; mechanical strength; micromechanical tester; pull strength; pull tests; relative motion; resistance change; silver particles; surface metallizations; Copper; Electric resistance; Fatigue; Fingers; Gold; Metallization; Micromechanical devices; Monitoring; Surface resistance; Testing;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742006
