Effect of bump height on flip-chip joint reliability using ACA

Author

Persson, Katrin ; Lai, Zonghe ; Zribi, Anis ; Liu, Johan ; Willander, Magnus

Author_Institution

Swedish Inst. of Production Eng. Res., Molndal, Sweden

fYear

1998

fDate

28-30 Sep 1998

Firstpage

132

Lastpage

136

Abstract

There are many parameters that influence the quality and reliability of flip-chip joints assembled using anisotropically conductive adhesives. In this study, the influence of bump height has been investigated. Electroless nickel/gold bumps of 4, 20, 40 and 70 μm in height have been used. The chips have been assembled on FR-4 substrates using an anisotropically conductive adhesive and the samples have been subjected to temperature cycling from -40 to +125°C. It has been concluded that the bump height is of importance for flip-chip joint quality and reliability. Theoretical calculations have been conducted to find the relationship between joint mechanical strength and bump height at various distances from the centre of the chip

Keywords

adhesives; conducting polymers; electroless deposition; filled polymers; flip-chip devices; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; mechanical strength; microassembling; -40 to 125 C; 20 micron; 4 micron; 40 micron; 70 micron; ACA; FR-4 substrates; Ni-Au; anisotropically conductive adhesives; bump height; bump height effects; electroless nickel/gold bump; flip-chip joint assembly; flip-chip joint quality; flip-chip joint reliability; joint mechanical strength; quality; reliability; temperature cycling; Anisotropic magnetoresistance; Assembly; Bonding; Conductive adhesives; Electronics packaging; Failure analysis; Optical microscopy; Scanning electron microscopy; Substrates; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.742015

Filename

742015