Title :
Investigations of plasma compatibility of SMT assembly adhesives
Author :
Wolter, K.-J. ; Detert, M. ; Herzog, Th.
Author_Institution :
Dept. of Electr. Eng., Tech. Univ. Dresden, Germany
Abstract :
The paper shows test results of the plasma compatibility of thermally cured SMT assembly adhesives. Investigations of different SMT assembly adhesives after a plasma treatment process using volumetric, mechanical and chemical tests were performed and the results were used to characterize the adhesives. The change of strength, elasticity, surface reactions, component lead and PCB pad contaminations, vacuum constancy and plasma stability of different current adhesives are compared. The test results after plasma treatment of assembly adhesives in both RF plasma and DC plasma are discussed and evaluated
Keywords :
adhesion; adhesives; assembling; conducting polymers; elasticity; heat treatment; integrated circuit packaging; plasma instability; plasma materials processing; printed circuit manufacture; printed circuit testing; soldering; surface chemistry; surface contamination; surface mount technology; surface treatment; DC plasma treatment; PCB pad contamination; RF plasma treatment; SMT assembly adhesives; adhesive characterization; adhesive elasticity; adhesive strength; adhesive surface reactions; adhesives; assembly adhesives; chemical tests; component lead contamination; mechanical tests; plasma compatibility; plasma process compatibility; plasma stability; plasma treatment; plasma treatment process; thermally cured SMT assembly adhesives; vacuum constancy; volumetric tests; Assembly; Chemical processes; Elasticity; Performance evaluation; Plasma chemistry; Plasma stability; Surface contamination; Surface treatment; Surface-mount technology; Testing;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742018
