• DocumentCode
    2503574
  • Title

    Fabrication and characterization of a quarter micron gate CMOS using ultra-thin Si film (30 nm) on SIMOX substrate

  • Author

    Miki, H. ; Omura, Y. ; Ohmameuda, T. ; Kumon, M. ; Asada, K. ; Izumi, K. ; Sakai, T. ; Sugano, T.

  • Author_Institution
    Dept. of Electron. Eng., Tokyo Univ., Japan
  • fYear
    1989
  • fDate
    3-6 Dec. 1989
  • Firstpage
    906
  • Lastpage
    908
  • Abstract
    Deep submicron-gate MOSFETs have been fabricated on ultrathin Si film of 30 nm, 50 nm, and 100 nm in thickness on SIMOX (separation by implanted oxygen) substrates. CMOS ring oscillators of 51 stages were fabricated to evaluate propagation delay. A high performance of 21.5 ps/stage (V/sub D/=2.5 V at room temperature) was observed for a 0.25- mu m-gate CMOS ring oscillator on the SIMOX substrate with Si film of 100 nm in thickness. By reducing the thickness of Si film on SIMOX substrates down to 30 nm, excellent immunity from short channel effects that is, independence of threshold voltage from gate length and low subthreshold voltage swings, was found.<>
  • Keywords
    CMOS integrated circuits; insulated gate field effect transistors; integrated circuit technology; 0.25 micron; 30 to 100 nm; SIMOX substrate; Si; deep submicron-gate MOSFETs; gate length; propagation delay; quarter micron gate CMOS; ring oscillators; separation by implanted oxygen; short channel effects; subthreshold voltage swings; threshold voltage; CMOS process; Degradation; Fabrication; MOSFETs; Propagation delay; Ring oscillators; Semiconductor films; Silicon; Substrates; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1989. IEDM '89. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-0817-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1989.74202
  • Filename
    74202