• DocumentCode
    2503669
  • Title

    Lubricants of silver fillers for conductive adhesive applications

  • Author

    Wong, C.P. ; Lu, Daoqiang ; Tong, Quinn K.

  • Author_Institution
    Mater. Sci. & Eng. & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    1998
  • fDate
    28-30 Sep 1998
  • Firstpage
    184
  • Lastpage
    192
  • Abstract
    Electrically conductive adhesives (ECAs) are composites of polymer matrices and conductive fillers. Silver (Ag) flakes are widely used as fillers for conductive adhesives. Generally, there is a thin layer of organic lubricant residue on the commercial Ag flake surface. This lubricant layer influences rheology, conductivity and other properties of ECAs. The nature of the lubricant on a Ag flake and the interaction between the lubricant and the Ag flake surface were studied by diffuse reflectance infrared spectroscopy (DRIR). Thermal decomposition of the lubricant was studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). In addition, the effects of some chemical compounds on lubricants were also investigated and are reported in this paper
  • Keywords
    adhesives; conducting polymers; differential scanning calorimetry; electrical conductivity; filled polymers; infrared spectra; lubrication; packaging; pyrolysis; reflectivity; rheology; silver; thermal analysis; Ag; Ag flake; Ag flake fillers; Ag flake surface; DRIR; DSC; ECAs; TGA; chemical compound effects; composites; conductive adhesive applications; conductive adhesives; conductive fillers; conductivity; differential scanning calorimetry; diffuse reflectance infrared spectroscopy; electrically conductive adhesives; lubricant layer; lubricant/Ag flake surface interactions; organic lubricant residue layer; polymer matrices; rheology; silver filler lubricants; thermal decomposition; thermogravimetric analysis; Active matrix organic light emitting diodes; Conductive adhesives; Conductivity; Infrared spectra; Lubricants; Polymers; Reflectivity; Rheology; Silver; Thermal decomposition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
  • Conference_Location
    Binghamton, NY
  • Print_ISBN
    0-7803-4934-2
  • Type

    conf

  • DOI
    10.1109/ADHES.1998.742025
  • Filename
    742025