DocumentCode
2503669
Title
Lubricants of silver fillers for conductive adhesive applications
Author
Wong, C.P. ; Lu, Daoqiang ; Tong, Quinn K.
Author_Institution
Mater. Sci. & Eng. & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
1998
fDate
28-30 Sep 1998
Firstpage
184
Lastpage
192
Abstract
Electrically conductive adhesives (ECAs) are composites of polymer matrices and conductive fillers. Silver (Ag) flakes are widely used as fillers for conductive adhesives. Generally, there is a thin layer of organic lubricant residue on the commercial Ag flake surface. This lubricant layer influences rheology, conductivity and other properties of ECAs. The nature of the lubricant on a Ag flake and the interaction between the lubricant and the Ag flake surface were studied by diffuse reflectance infrared spectroscopy (DRIR). Thermal decomposition of the lubricant was studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). In addition, the effects of some chemical compounds on lubricants were also investigated and are reported in this paper
Keywords
adhesives; conducting polymers; differential scanning calorimetry; electrical conductivity; filled polymers; infrared spectra; lubrication; packaging; pyrolysis; reflectivity; rheology; silver; thermal analysis; Ag; Ag flake; Ag flake fillers; Ag flake surface; DRIR; DSC; ECAs; TGA; chemical compound effects; composites; conductive adhesive applications; conductive adhesives; conductive fillers; conductivity; differential scanning calorimetry; diffuse reflectance infrared spectroscopy; electrically conductive adhesives; lubricant layer; lubricant/Ag flake surface interactions; organic lubricant residue layer; polymer matrices; rheology; silver filler lubricants; thermal decomposition; thermogravimetric analysis; Active matrix organic light emitting diodes; Conductive adhesives; Conductivity; Infrared spectra; Lubricants; Polymers; Reflectivity; Rheology; Silver; Thermal decomposition;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location
Binghamton, NY
Print_ISBN
0-7803-4934-2
Type
conf
DOI
10.1109/ADHES.1998.742025
Filename
742025
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