DocumentCode
2503900
Title
Development of reworkable underfills, materials, reliability and processing
Author
Crane, Lawrence ; Torres-Filho, Mario ; Ober, Christopher K. ; Yang, Shu ; Chen, Jir-shyr ; Johnson, R. Wayne
Author_Institution
Loctite Corp., Rocky Hill, CT, USA
fYear
1998
fDate
28-30 Sep 1998
Firstpage
262
Lastpage
265
Abstract
The development of a reworkable underfill system for flip chip assembly is described. The materials selection process, information on the process for rework and pertinent reliability data are described
Keywords
encapsulation; flip-chip devices; integrated circuit design; integrated circuit packaging; integrated circuit reliability; maintenance engineering; flip chip assembly; materials selection process; reliability data; rework process; reworkable underfill system; reworkable underfills; underfill materials; underfill processing; underfill reliability; Additives; Chemicals; Chip scale packaging; Cranes; Electronics packaging; Materials reliability; Resins; Solvents; Space technology; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location
Binghamton, NY
Print_ISBN
0-7803-4934-2
Type
conf
DOI
10.1109/ADHES.1998.742037
Filename
742037
Link To Document