Title :
Residual strength of OLB in a TAB assembly with ACF after thermal and mechanical loading
Author :
Wu, C.M.L. ; Yeung, N.H. ; Chau, M.L. ; Lai, J.K.L.
Author_Institution :
City Univ. of Hong Kong, Hong Kong
Abstract :
The key parameters of temperature, pressure, and time during bonding of the outer lead bonds (OLB) in a tape automated bonding (TAB) assembly with anisotropic conductive film (ACF) were investigated. In our study, thermal aging and thermal shock treatments were used to evaluate their reliability. Also, peel tests and microstructural examinations were conducted. It was found that the peel strength decreased slightly with the bonding temperature and bonding pressure. However, peel strength seemed to be stable with bonding time. In the aging test, the results showed that the peel strength decreased as the aging time increased. Moreover, results from scanning electron microscopy (SEM) showed that some voids were revealed near the TAB polyimide in the thermal shock treatment
Keywords :
adhesion; ageing; circuit reliability; conducting polymers; polymer films; scanning electron microscopy; tape automated bonding; thermal analysis; thermal shock; voids (solid); ACF; OLB; SEM; TAB assembly; TAB polyimide; aging test; aging time; anisotropic conductive film; bonding pressure; bonding temperature; bonding time; mechanical loading; microstructural examinations; outer lead bonds; peel strength; peel tests; reliability; residual strength; scanning electron microscopy; tape automated bonding assembly; thermal aging; thermal loading; thermal shock treatment; voids; Aging; Assembly; Bonding; Glass; Integrated circuit interconnections; Lead; Packaging; Temperature; Testing; Thermal loading;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742044
