• DocumentCode
    2504136
  • Title

    Studies of underfill formulation effects using molecular dynamics and discrete element modeling

  • Author

    Iwamoto, N. ; Li, M. ; McCaffery, S.J. ; Nakagawa, M. ; Mustoe, G.

  • Author_Institution
    Johnson Matthey Electron. Inc., San Diego, CA, USA
  • fYear
    1998
  • fDate
    28-30 Sep 1998
  • Firstpage
    321
  • Lastpage
    327
  • Abstract
    The underfill phenomenon is driven by many dynamic interactions which can be studied from a fundamental standpoint. Although capillary action generally drives the filling phenomenon, it is the underlying principles that govern the underfill performance properties which must be understood. For instance, flow speed, filler settling, filler striation and voiding are all properties that require mechanistic understanding. Although binder and filler effects are expected from a combination of surface energy and particle dynamics drivers, the simple identification of the problem does not instruct on how to control these effects; and for the formulator or the end-use engineer, such understanding must be reduced to controllable variables. In order to address these issues, both molecular modeling and discrete element modeling have been used to understand the formulation constituent effects
  • Keywords
    discharges (electric); encapsulation; filled polymers; finite element analysis; flow simulation; molecular dynamics method; packaging; surface chemistry; surface energy; voids (solid); binder effects; capillary action; controllable variables; discrete element modeling; dynamic interactions; filler effects; filler settling; filler striation; filling phenomenon; flow speed; formulation constituent effects; molecular dynamics modeling; molecular modeling; particle dynamics; surface energy; underfill formulation effects; underfill performance properties; underfill phenomenon; voiding; Adhesives; Atomic measurements; Drag; Filling; Fluid dynamics; Lubrication; Mechanical factors; Mechanical variables measurement; Power engineering and energy; Quantum mechanics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
  • Conference_Location
    Binghamton, NY
  • Print_ISBN
    0-7803-4934-2
  • Type

    conf

  • DOI
    10.1109/ADHES.1998.742048
  • Filename
    742048