Viscosity measurements and models of underfill mixtures

Author

Li, P.C. ; Cotts, E.J. ; Guo, Y. ; Lehmann, G.L.

Author_Institution

Dept. of Phys., State Univ. of New York, Binghamton, NY, USA

fYear

1998

fDate

28-30 Sep 1998

Firstpage

328

Lastpage

333

Abstract

Measurement of the viscosity of commercial underfill mixtures has been conducted with a rotating parallel disk rheometer. Capillary flow of the mixtures into a channel formed by parallel glass walls is used to simulate the underfill process. The mixture viscosity is deduced from the underfill simulation with a model based on (1) a uniform concentration profile, or (2) a variable concentration profile. When comparing data from the different flow configurations, the variable concentration profile model provides the best agreement with experiments

Keywords

capillarity; encapsulation; flip-chip devices; flow simulation; integrated circuit measurement; integrated circuit packaging; microassembling; rheology; semiconductor process modelling; viscosity; capillary flow; direct chip attachment packaging; flow configurations; parallel glass wall channel; rotating parallel disk rheometer; underfill mixture viscosity; underfill mixtures; underfill process model; underfill process simulation; underfill simulation; uniform concentration profile; variable concentration profile; variable concentration profile model; viscosity; viscosity measurements; viscosity models; Glass; Mechanical engineering; Mechanical variables measurement; Physics; Rotation measurement; Solids; Stress; Suspensions; Temperature; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.742049

Filename

742049