DocumentCode :
2504243
Title :
Composed material studies with microwave simulation methods
Author :
Ionescu, Daniela ; Cehan, Wad
Author_Institution :
Dept. of Telecommun., "Gh. Asachi" Tech. Univ., Romania
fYear :
2003
fDate :
8-11 May 2003
Firstpage :
80
Lastpage :
84
Abstract :
This article is a study of composed materials, specific to multilayered PCBs, in particular of the multilayered structure: conducting path-dielectric layer-conducting plane. These dielectric-conductor structures have been studied with microwave simulation methods, in the frequency range 1-10GHz, using a specific simulation program, HFFS. The electrical permittivities were obtained for electric field orientation parallel and transverse to the main geometrical axis. The geometry and composition influence on the electrical properties of the material were studied. The geometrical and physical resonances are found and the possibilities of avoiding them by controlling the macroscopic material structure are discussed. The frequency dependence of the permittivities shows that, the greater the frequency field, the smaller is the substance´s response to the external field. This study continues our previous work, already published in two articles in national revues.
Keywords :
conducting materials; dielectric materials; microwave technology; multilayers; permittivity; printed circuits; 1 to 10 GHz; composed material studies; conducting path; conducting plane; dielectric layer; dielectric-conductor structures; electrical permittivity; microwave simulation methods; multilayered printed circuit boards; multilayered structure; Conducting materials; Copper; Dielectric materials; Dielectric substrates; Electromagnetic fields; Electromagnetic waveguides; Frequency; Magnetic materials; Microwave theory and techniques; Resonance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN :
0-7803-8002-9
Type :
conf
DOI :
10.1109/ISSE.2003.1260488
Filename :
1260488
Link To Document :
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