DocumentCode :
2504298
Title :
Low-tech studies of isotropic electrically conductive adhesives
Author :
Morris, James E. ; Anderssohn, Falk ; Loos, Enrico ; Liu, Johan
Author_Institution :
Dept. of Electr. & Comput. Eng., Portland State Univ., OR, USA
fYear :
2003
fDate :
8-11 May 2003
Firstpage :
90
Lastpage :
94
Abstract :
The experiments described here can provide a laboratory component to a course on isotropic conductive adhesives (ICAs), with minimal specialized equipment. Furthermore, some of the techniques can be used in ICA research to provide more controllable, reproducible results than are typically obtained with commercial devices.
Keywords :
adhesives; materials testing; reliability; electrically conductive adhesives; isotropic conductive adhesives; Chemical technology; Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Conductive adhesives; Electrical resistance measurement; Hardware; Independent component analysis; Ovens; Packaging machines; Temperature control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN :
0-7803-8002-9
Type :
conf
DOI :
10.1109/ISSE.2003.1260490
Filename :
1260490
Link To Document :
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