• DocumentCode
    2504348
  • Title

    Addendum: "Effect Of Bump Height On Flip-chip Joint Reliability Using ACA"

  • Author

    Persson, K. ; Lai, Zu-Hao ; Zribi, Amin ; Liu, Jiangchuan ; Willander, Magnus

  • fYear
    1998
  • fDate
    30-30 Sept. 1998
  • Firstpage
    366
  • Lastpage
    366
  • Abstract
    Missing figure between Figures 5 and 6, pages 134 & 135 and section 4: Results and Discussion.
  • Keywords
    Circuit testing; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
  • Conference_Location
    Binghamton, NY, USA
  • Print_ISBN
    0-7803-4934-2
  • Type

    conf

  • DOI
    10.1109/ADHES.1998.742058
  • Filename
    742058
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2504348