Title :
Addendum: "Effect Of Bump Height On Flip-chip Joint Reliability Using ACA"
Author :
Persson, K. ; Lai, Zu-Hao ; Zribi, Amin ; Liu, Jiangchuan ; Willander, Magnus
Abstract :
Missing figure between Figures 5 and 6, pages 134 & 135 and section 4: Results and Discussion.
Keywords :
Circuit testing; Temperature;
Conference_Titel :
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location :
Binghamton, NY, USA
Print_ISBN :
0-7803-4934-2
DOI :
10.1109/ADHES.1998.742058
