Title :
Surface treatment of PA6 and ABS with oxygen plasma for molded interconnect devices
Author :
Paproth, A. ; Wolter, K.-J. ; Deltschew, R.
Author_Institution :
Electron. Technol. Lab., Dresden Univ. of Technol., Germany
Abstract :
Polymer materials are widely used in electronic packaging. Especially adhesion properties are of interest for the bonding polymer-metal and their peel strength. The adhesion of copper on polymer substrates is more and more importance. A lot of polymer materials have low energy surfaces whereas metals have high energy surfaces. In order to reach adhesion between these two kinds of materials, polar groups must be produced at the low-energy surface. By plasma treatment with different gases or gas mixtures, for example CO2, Ar, N2 or Ar+O2, polar groups can be produced on the polymer surfaces. The oxygen plasma or the plasma with oxygen containing gas mixtures represents the standard plasma for the treatment of polymer surfaces. It is well known that the oxygen plasma can react with most polymer materials and can produce a multiplicity of oxygen containing functional groups on the polymer surface. Such functional groups are for example C-O, C=O, O-C=O and C-OH. The increase of polar groups can be proven on the polymer surface by using XPS measurement. This paper gives an overview of the principles of plasma treatment and of the results by XPS measurements of plasma treated polymers.
Keywords :
X-ray photoelectron spectra; adhesion; electronics packaging; plasma materials processing; polymers; surface treatment; ABS; PA6; XPS measurement; acrylnitril-butadien-styrol; adhesion property; electronic packaging; energy surface; functional groups; gas mixtures; molded interconnect device; oxygen plasma; plasma treated polymer; plasma treatment; polar group; polyamide; polymer materials; polymer substrates; polymer-metal bonding; surface treatment; Adhesives; Bonding; Electronics packaging; Plasma applications; Plasma devices; Plasma materials processing; Plasma measurements; Plasma properties; Polymers; Surface treatment;
Conference_Titel :
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN :
0-7803-8002-9
DOI :
10.1109/ISSE.2003.1260497