Influence of the conductive adhesives joints to decoupling impedance

Design of the power distribution system is becoming an increasingly difficult challenge for modern complementary metal-oxide-semiconductor technology. Simultaneous switching noise is a major concern in present for microprocessors and application specific integrated circuits due to a combination of fast switching circuits, high clock frequencies, wide buses and low voltage levels. A major requirement to limit switching noise is the need for a low impedance power distribution system over a large frequency bandwidth and for this purpose it is used the decoupling. In the paper the influence of the conductive adhesives joints to decoupling impedance will be analyzed. To do this, the impedance of the decoupling line and their parameters (equivalent series resistance and equivalent series inductance) will be measured using appropriate test structures configurations. For these structures different adhesives formulations, different power supply line configurations and different type of decoupling capacitors will be investigated.