Title :
Microelectronics packaging education related projects at BUTE-ETT
Author :
Illyefalvi-Vitéz, Zsolt
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
Abstract :
The paper gives an overview on the objectives and the progress of three European Commission sponsored projects, which are in connection with microelectronics packaging education. The role of the Department of Electronics Technology at Budapest University of Technology and Economics, as well as, the benefits of colleagues and institutions of the Newly Associate States (NAS) countries is discussed. The following three projects are in the scope: 1. NETPACK: Network of Excellence in Microelectronics Packaging (www.netpack-europe.org); 2. EuroTraining: Provision of microsystems and related training in Europe (www.eutraining.net); 3. IPCI: Performance Centred Vocational Education - the link between work and education (Leonardo Pilot Project).
Keywords :
integrated circuit packaging; training; BUTE-ETT; EuroTraining; IPCI; Leonardo Pilot Project; NETPACK; Network of Excellence in Microelectronics Packaging; Performance Centred Vocational Education; microelectronics packaging education; microsystems training; Cultural differences; Educational technology; Electronics packaging; Europe; Face recognition; Global communication; Internet; Microelectronics; Portals; Space technology;
Conference_Titel :
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN :
0-7803-8002-9
DOI :
10.1109/ISSE.2003.1260552
