DocumentCode
2505411
Title
Quality determination of microwelding connections of integral schemes
Author
Tsyganok, B. ; Friedel, J.
Author_Institution
Dept. of Electron., Nat. Tech. Univ. of Ukraine, Kiev, Ukraine
fYear
2003
fDate
8-11 May 2003
Firstpage
369
Lastpage
370
Abstract
In this paper are given some results of analysis of microwelded connections by photoacoustic microscopy. This method can be used for gradiated appreciation of quality control of connections in electronics.
Keywords
acoustic microscopy; microassembling; photoacoustic effect; quality control; ultrasonic welding; electronic connection; gradiated appreciation; integral schemes; microwelding connections; photoacoustic microscopy; quality control; quality determination; Adhesives; Aluminum; Electron microscopy; Frequency modulation; Optical materials; Photoacoustic effects; Quality control; Silicon; Testing; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN
0-7803-8002-9
Type
conf
DOI
10.1109/ISSE.2003.1260553
Filename
1260553
Link To Document