A time domain surface integral technique for mixed electromagnetic and circuit simulation

Author

Yang, Chuanyi ; Jandhyala, Vikram

Author_Institution

Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA

fYear

2002

fDate

21-23 Oct. 2002

Firstpage

41

Lastpage

44

Abstract

A full-wave time domain surface integral approach to coupled electromagnetic and circuit simulation is presented in this paper. In particular, non-linear circuit elements and effects of interference and crosstalk can be modeled in the time domain. The coupling of lumped elements to a surface integral formulation is detailed. Losses are modeled with an efficient recursive convolution.

Keywords

circuit simulation; convolution; crosstalk; electromagnetic field theory; electromagnetic wave interference; integral equations; lumped parameter networks; nonlinear network analysis; recursive estimation; time-domain analysis; coupled EM/circuit simulation; crosstalk effects; full-wave time domain surface integral technique; interference effects; lumped elements coupling; mixed electromagnetic/circuit simulation; nonlinear circuit elements; recursive convolution-based loss model; surface integral formulation; time domain model; Circuit simulation; Convolution; Coupling circuits; Electromagnetic coupling; Integral equations; Interference; Message-oriented middleware; Moment methods; Surface impedance; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-7451-7

Type

conf

DOI

10.1109/EPEP.2002.1057879

Filename

1057879