Title :
Table of contents
fDate :
May 30 2012-June 1 2012
Abstract :
The following topics are dealt with: graphene; carbon nanotechnology; data center cooling; energy efficiency; thermoelectric technology; advanced packaging; fracture; damage mechanics; chip level thermal management; mold compounds; resins; laminates; semiconductor compound; heat sinks; heat spreaders; prognostic health management; solder damage mechanism; 3D stacked die cooling; interconnect reliability; single phase liquid cooling; refrigeration; phase change; thermosiphon; lead-free solder materials; MEMS; LED cooling; strain-rate mechanics; energy conversion systems; air cooling; jet cooling; and spray cooling.
Keywords :
computer centres; fracture; graphene; heat sinks; integrated circuit interconnections; integrated circuit reliability; jets; laminates; light emitting diodes; micromechanical devices; nanotechnology; refrigeration; resins; semiconductor materials; solders; thermal management (packaging); thermoelectricity; 3D stacked die cooling; LED cooling; MEMS; advanced packaging; air cooling; carbon nanotechnology; chip level thermal management; damage mechanics; data center cooling; energy conversion systems; energy efficiency; fracture; graphene; heat sinks; heat spreaders; interconnect reliability; jet cooling; laminates; lead-free solder materials; mold compounds; phase change; prognostic health management; refrigeration; resins; semiconductor compound; single phase liquid cooling; solder damage mechanism; spray cooling; strain-rate mechanics; thermoelectric technology; thermosiphon;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231404
