• DocumentCode
    2505467
  • Title

    Effect of Nano SiO2 on Pyrolytic Reaction of Phenol-Formaldehyde Resin

  • Author

    Peng Wan-Xi ; Wu Yi-qiang ; Zhang Zhong-feng ; Qi Hong-Chen ; Ma Qing-zhi

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Central South Univ. of Forestry & Technol., Changsha, China
  • fYear
    2009
  • fDate
    11-13 June 2009
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Phenol-formaldehyde resin is used as the most adhesive to produce waterproof plant-based composite. However, this product contains phenol and formaldehyde which can be easily released to pollute air. Based on the single-factor method, the effect of nano SiO2 on situation of pyrolytic reaction of PF resin was studied by Py-GC/MS. The results were shown that the components of PF by Py-GC-MS analysis were carbon dioxide(83.54%), D,.alpha.-tocopherol (12.55%), 1,3-bis(trimethylsilyl) benzene (1.96%), phenol(1.95%). And the results were shown that the main components of PF/SiO2 composite by Py-GC-MS analysis were as follow: carbon dioxide (60.37%), 2-butanamine (14.41%), fluoxetine (12.09%), 2,6,10-dodecatrien-1-ol, 3,7,11-trimethyl-, acetate, (E,E)- (3.38%), bis(2-ethylhexyl) phthalate(3.35%), phenol, 2-methyl-(3.12%), phenol(2.39%), 2-propanamine(0.89%). The result showed that nano SiO2 could effectively delay the pyrolysis of PF resin.
  • Keywords
    composite materials; nanoparticles; pyrolysis; resins; silicon compounds; Py-GC-MS analysis; SiO2; nano SiO2; phenol-formaldehyde resin; pyrolytic reaction; single-factor method; Carbon dioxide; Degradation; Helium; Ionization; Materials science and technology; Nanoparticles; Optical materials; Resins; Temperature; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioinformatics and Biomedical Engineering , 2009. ICBBE 2009. 3rd International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2901-1
  • Electronic_ISBN
    978-1-4244-2902-8
  • Type

    conf

  • DOI
    10.1109/ICBBE.2009.5162704
  • Filename
    5162704