Finite-thickness conductor models for full-wave analysis of interconnects with the adaptive integral method

Author

Morsey, Jason ; Okhmatovski, Vladimir ; Cangellaris, Andreas C.

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

fYear

2002

fDate

21-23 Oct. 2002

Firstpage

45

Lastpage

48

Abstract

Modeling methodologies are proposed for lossy conductors of finite thickness. The proposed models are such that neither the ease of implementation nor the computational efficiency of a fast adaptive integral equation method-based electromagnetic field solver is penalized.

Keywords

circuit analysis computing; computational complexity; electromagnetic field theory; integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; adaptive integral equation method-based electromagnetic field solver; computational efficiency; finite thickness lossy conductors; finite-thickness conductor models; full-wave interconnect analysis; modeling methodologies; Computational efficiency; Conductivity; Conductors; Crosstalk; Electromagnetic analysis; Electromagnetic fields; Electromagnetic modeling; Integral equations; Packaging; Surface impedance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-7451-7

Type

conf

DOI

10.1109/EPEP.2002.1057880

Filename

1057880