• DocumentCode
    2505479
  • Title

    Effect of copper surface roughness on thermal conductance of copper/carbon nanotube array interface

  • Author

    Chu, Rong-Shiuan ; Zhao, Yang ; Grigoropoulos, Costas P.

  • Author_Institution
    Dept. of Mech. Eng., Appl. Sci. & Technol. Grad. Group, Univ. of California, Berkeley, Berkeley, CA, USA
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    10
  • Lastpage
    14
  • Abstract
    In this work, we demonstrate a systematic study on the contact conductance of Cu/carbon nanotube array interface and the effective thermal conductivity of carbon nanotube array as a function of out-of-plane root-mean-square surface roughness of copper. The rms roughness of Cu was controlled at 0.005, 0.024, 0.065, and 0.192 μm, and the carbon nanotube array was bonded to the controlled Cu surface with In. Using phase sensitive thermal reflectance thermometry, we found that the effective thermal conductivity does not affect by the Cu surface roughness while the contact conductance increased from 0.14 MW/m2-K to 1.2 MW/m2-K as the Cu surface roughness decreased from 0.192 μm to 0.065 μm. Such an increasing trend in contact thermal conductance suggests that the scale of target surface roughness is one of the key factors for CNT arrays based TIMs reach to order of 1 MW/m2K in thermal conductance.
  • Keywords
    carbon nanotubes; copper; least mean squares methods; surface roughness; thermal conductivity; CNT array; Cu; TIM; contact conductance; copper surface roughness; copper-carbon nanotube array interface; phase sensitive thermal reflectance thermometry; rms roughness; root-mean-square surface roughness; thermal conductance; thermal conductivity; Arrays; Carbon nanotubes; Rough surfaces; Surface roughness; Surface topography; Surface treatment; Thermal conductivity; Aligned Carbon Nanotube Array; Contact Conductance; Cu Surface Roughness; Effective Thermal Conductivity; Thermal Interface Materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231407
  • Filename
    6231407