DocumentCode :
2505500
Title :
Quasi-CPW lines on MCM-D for the realisation of via-less transmission elements and distributed passives
Author :
Grzyb, Janusz ; Ruiz, Ivan ; Klemm, Maciej ; Tröster, G.
Author_Institution :
Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
fYear :
2002
fDate :
21-23 Oct. 2002
Firstpage :
51
Lastpage :
54
Abstract :
This paper presents the ´quasi-CPW´ and ´quasi-ACPS´ transmission lines as the base elements for the via-less realisation of different transmission elements and distributed passives in low-cost MCM-D technology. This new approach simplifies the design, avoids via-processing problems and reduces the required computational resources in the design phase. Additionally, lower line characteristic impedances become achievable allowing the realisation of some distributed elements, which are not feasible in standard CPW configuration. The use of ´quasi-ACPS´ lines in junctions avoids the slot-mode excitation. The presented investigations are within the framework of the European project LIPS (Low Cost Interconnect, Packaging and Subsystem Integration Technologies for Millimetre-Wave Applications).
Keywords :
circuit CAD; coplanar transmission lines; coplanar waveguide components; coplanar waveguides; electric impedance; integrated circuit interconnections; integrated circuit packaging; millimetre wave filters; multichip modules; strip line components; strip lines; European LIPS project; MCM-D; base elements; design phase computational resources; distributed passives; interconnect technologies; junction slot-mode excitation; line characteristic impedances; millimetre-wave applications; packaging technologies; quasi-ACPS transmission lines; quasi-CPW transmission lines; quasi-asymmetric CPS lines; standard CPW configuration; subsystem integration technologies; via-less transmission elements; via-processing; Attenuation; Coplanar waveguides; Costs; Frequency; Impedance; Indium phosphide; Isolation technology; Laminates; Strips; Transmission line discontinuities;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
Type :
conf
DOI :
10.1109/EPEP.2002.1057881
Filename :
1057881
Link To Document :
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