Title :
Performance of low cost PBGA package for 10 Gb/s applications
Author :
Zhou, Xingling ; Fang, Nancy J.
Author_Institution :
Agere Syst., Allentown, PA, USA
Abstract :
Electrical characterization data are presented in this paper to demonstrate a low cost, mid-I/O range plastic ball grid array (PBGA) package as an effective packaging solution for 10 Gb/s applications such as SONET/SDH and Ethernet.
Keywords :
SONET; ball grid arrays; integrated circuit measurement; integrated circuit packaging; local area networks; plastic packaging; synchronous digital hierarchy; 10 Gbit/s; Ethernet; PBGA; SDH; SONET; effective packaging solution; electrical characterization; low cost PBGA package; mid-I/O range plastic ball grid array package; Ceramics; Circuit simulation; Costs; Dielectric substrates; Electronics packaging; Integrated circuit packaging; Laminates; Manufacturing; Plastic packaging; Scattering parameters;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057886
