Title :
Low cost plastic packaging for high-power limiters
Author :
Coffman, Zeb E. ; Teti, Richard J. ; Miller, Stephen C. ; Gribbons, Michael A.
Author_Institution :
NE&SS-Surface Syst., Lockheed Martin, Moorestown, NJ, USA
Abstract :
We describe the design, construction, and performance of a T/R module receive limiter implemented in Lockheed Martin´s Plastic High Density Interconnect (PHDI) technology. Realization of the receive limiter in PHDI technology minimizes size and cost, while maintaining excellent thermal and electrical performance.
Keywords :
antenna phased arrays; integrated circuit interconnections; integrated circuit packaging; limiters; phased array radar; plastic packaging; radar antennas; radar receivers; transceivers; Lockheed Martin Plastic High Density Interconnect technology; PHDI technology; T/R module receive limiter; antenna aperture; electrical performance; high-power limiters; low cost plastic packaging; package cost; package size; phased array radars; solid state transmit/receive modules; thermal performance; Capacitors; Costs; Coupling circuits; Electronics packaging; Integrated circuit interconnections; Manufacturing; P-i-n diodes; Phased arrays; Plastic packaging; Schottky diodes;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057887
