Low cost plastic packaging for high-power limiters

Author

Coffman, Zeb E. ; Teti, Richard J. ; Miller, Stephen C. ; Gribbons, Michael A.

Author_Institution

NE&SS-Surface Syst., Lockheed Martin, Moorestown, NJ, USA

fYear

2002

fDate

21-23 Oct. 2002

Firstpage

79

Lastpage

82

Abstract

We describe the design, construction, and performance of a T/R module receive limiter implemented in Lockheed Martin´s Plastic High Density Interconnect (PHDI) technology. Realization of the receive limiter in PHDI technology minimizes size and cost, while maintaining excellent thermal and electrical performance.

Keywords

antenna phased arrays; integrated circuit interconnections; integrated circuit packaging; limiters; phased array radar; plastic packaging; radar antennas; radar receivers; transceivers; Lockheed Martin Plastic High Density Interconnect technology; PHDI technology; T/R module receive limiter; antenna aperture; electrical performance; high-power limiters; low cost plastic packaging; package cost; package size; phased array radars; solid state transmit/receive modules; thermal performance; Capacitors; Costs; Coupling circuits; Electronics packaging; Integrated circuit interconnections; Manufacturing; P-i-n diodes; Phased arrays; Plastic packaging; Schottky diodes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-7451-7

Type

conf

DOI

10.1109/EPEP.2002.1057887

Filename

1057887