Title :
Modeling of spiral and meander lines in multilayer passive integration
Author :
Kelander, Ilkka ; Arslan, Ali ; Hurskainen, Ville
Author_Institution :
Nokia Res. Center, Espoo, Finland
Abstract :
In this paper, we present design and modeling techniques for transmission line passive components integrated on multilayer LTCC package. We discuss and characterize spiral and meander type lines, which may enable considerable size and cost reduction of RF modules.
Keywords :
baluns; ceramic packaging; coupled transmission lines; equivalent circuits; high-frequency transmission lines; hybrid integrated circuits; impedance convertors; integrated circuit packaging; radiofrequency filters; radiofrequency integrated circuits; waveguide couplers; RF modules; baluns; cost reduction; couplers; design techniques; filters; impedance transformers; meander type lines; modeling; multilayer LTCC package integration; multilayer passive integration; size reduction; spiral type lines; transmission line passive components; Capacitance; Ceramics; Coupling circuits; Impedance; Nonhomogeneous media; Radio frequency; Spirals; Strips; Temperature; Transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057888
