• DocumentCode
    2505650
  • Title

    High-capacity thermoelectric heat exchanger

  • Author

    Lu, Kevin S. ; Pellicone, Devin ; Bonner, Richard ; Fleming, Evan ; Reist, Daniel ; Reber, Geneva L. ; Walker, Jessica N.

  • Author_Institution
    Adv. Cooling Technol., Inc., Lancaster, PA, USA
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    78
  • Lastpage
    85
  • Abstract
    This study investigates the feasibility of integrating thermoelectric devices into a large-capacity heat exchanger (up to 100 kW). Typically, thermal-electrical conversion is inefficient and thermoelectrics are only used in low-power applications (<;1 kW). The incentive for using thermoelectrics, however, lies in their compact size, light-weight, high reliability, and sub-ambient cooling. In this study, a prototype thermoelectric heat exchanger is designed, fabricated and optimized for performance through testing and simulation. Specifically, direct fluid contact and jet-impingement were used to improve heat transfer at every thermoelectric hot/cold junction. This resulted in a five-fold increase in cooling capacity to pumping power. Experimentally validated predictions also demonstrated that the full-scale heat exchanger is lighter per unit-power than comparable vapor-compression systems. This feasibility study raises the outlook of reducing thermoelectric technology to practice in large heat load applications.
  • Keywords
    heat exchangers; jets; reliability; thermoelectric conversion; thermoelectric cooling; direct fluid contact; full-scale heat exchanger; heat load; heat transfer; high-capacity thermoelectric heat exchanger; jet-impingement; reliability; subambient cooling; thermal-electrical conversion; thermoelectric devices; thermoelectric hot-cold junction; thermoelectric technology; vapor-compression systems; Cooling; Fluids; Heat transfer; Resistance heating; Steady-state; Testing; liquid cooling; shell-in-tube; vapor compression;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231416
  • Filename
    6231416