DocumentCode :
2505650
Title :
High-capacity thermoelectric heat exchanger
Author :
Lu, Kevin S. ; Pellicone, Devin ; Bonner, Richard ; Fleming, Evan ; Reist, Daniel ; Reber, Geneva L. ; Walker, Jessica N.
Author_Institution :
Adv. Cooling Technol., Inc., Lancaster, PA, USA
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
78
Lastpage :
85
Abstract :
This study investigates the feasibility of integrating thermoelectric devices into a large-capacity heat exchanger (up to 100 kW). Typically, thermal-electrical conversion is inefficient and thermoelectrics are only used in low-power applications (<;1 kW). The incentive for using thermoelectrics, however, lies in their compact size, light-weight, high reliability, and sub-ambient cooling. In this study, a prototype thermoelectric heat exchanger is designed, fabricated and optimized for performance through testing and simulation. Specifically, direct fluid contact and jet-impingement were used to improve heat transfer at every thermoelectric hot/cold junction. This resulted in a five-fold increase in cooling capacity to pumping power. Experimentally validated predictions also demonstrated that the full-scale heat exchanger is lighter per unit-power than comparable vapor-compression systems. This feasibility study raises the outlook of reducing thermoelectric technology to practice in large heat load applications.
Keywords :
heat exchangers; jets; reliability; thermoelectric conversion; thermoelectric cooling; direct fluid contact; full-scale heat exchanger; heat load; heat transfer; high-capacity thermoelectric heat exchanger; jet-impingement; reliability; subambient cooling; thermal-electrical conversion; thermoelectric devices; thermoelectric hot-cold junction; thermoelectric technology; vapor-compression systems; Cooling; Fluids; Heat transfer; Resistance heating; Steady-state; Testing; liquid cooling; shell-in-tube; vapor compression;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231416
Filename :
6231416
Link To Document :
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