Title :
A reliability study with infrared imaging of thermoelectric modules under thermal cycling
Author :
Barako, Michael T. ; Park, Woosung ; Marconnet, Amy M. ; Asheghi, Mehdi ; Goodson, Kenneth E.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., Escondido, CA, USA
fDate :
May 30 2012-June 1 2012
Abstract :
Thermoelectric (TE) modules undergo performance degradation and mechanical failure due to thermal cycling. In the present study, TE modules are subjected to thermal cycling, and the thermoelectric performance is evaluated at periodic intervals. Both the thermoelectric figure of merit, ZT, and the individual components of ZT are measured at each interval. The thermopower and thermal conductivity are measured using steady state infrared microscopy, and the electrical conductivity and ZT are evaluated using a variation of the Harman technique. These properties are tracked over many cycles until device failure. Critical failure occurred after 45,000 thermal cycles, and the mechanical failure of the TE module is analyzed using high-resolution infrared microscopy and scanning electron microscopy. These results quantify the effect of thermal cycling on a commercial TE module performance and provide insight into the packaging of a complete TE module for reliable operation.
Keywords :
electrical conductivity; failure analysis; infrared imaging; reliability; scanning electron microscopy; thermal conductivity; thermoelectric conversion; thermoelectric devices; Harman technique; TE module; TE module performance; device failure; electrical conductivity; high-resolution infrared microscopy; infrared imaging; mechanical failure; reliability study; scanning electron microscopy; steady state infrared microscopy; thermal conductivity; thermal cycling; thermoelectric figure of merit; thermoelectric modules; thermopower; Copper; Mechanical variables measurement; Optical imaging; Resistance heating; Voltage measurement; Harman method; infrared failure analysis; infrared microscopy; thermoelectric materials;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231417