Title :
3D measuring methods for visual inspection of advanced packages
Author :
Schaulin, Michael
Author_Institution :
Dept. of Electr. Eng. & Inf. Technol., Dresden Univ. of Technol., Germany
Abstract :
The purpose of the work is an evaluation of existing 3D measuring methods for their applicability in sensors for the manufacturing process. Different 3D measuring methods with their special characteristics are discussed. To find suitable criteria for evaluation, the components are examined for their optical and geometrical characteristics. The custom-specific evaluation can be used at the development of 3D sensors to choose a suitable measuring method or to weigh up its advantages and disadvantages in the application.
Keywords :
inspection; manufacturing processes; measurement systems; sensors; 3D measuring methods; 3D sensors; advanced packages; manufacturing process; visual inspection; Assembly; Consumer electronics; Distance measurement; Electric variables measurement; Inspection; Optical devices; Optical sensors; Optical variables control; Packaging; Sensor arrays;
Conference_Titel :
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN :
0-7803-8002-9
DOI :
10.1109/ISSE.2003.1260566
