DocumentCode
2505673
Title
3D measuring methods for visual inspection of advanced packages
Author
Schaulin, Michael
Author_Institution
Dept. of Electr. Eng. & Inf. Technol., Dresden Univ. of Technol., Germany
fYear
2003
fDate
8-11 May 2003
Firstpage
427
Lastpage
432
Abstract
The purpose of the work is an evaluation of existing 3D measuring methods for their applicability in sensors for the manufacturing process. Different 3D measuring methods with their special characteristics are discussed. To find suitable criteria for evaluation, the components are examined for their optical and geometrical characteristics. The custom-specific evaluation can be used at the development of 3D sensors to choose a suitable measuring method or to weigh up its advantages and disadvantages in the application.
Keywords
inspection; manufacturing processes; measurement systems; sensors; 3D measuring methods; 3D sensors; advanced packages; manufacturing process; visual inspection; Assembly; Consumer electronics; Distance measurement; Electric variables measurement; Inspection; Optical devices; Optical sensors; Optical variables control; Packaging; Sensor arrays;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN
0-7803-8002-9
Type
conf
DOI
10.1109/ISSE.2003.1260566
Filename
1260566
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