• DocumentCode
    25057
  • Title

    Analysis and Optimization of a Thyristor Structure Using Backside Schottky Contacts Suited for the High Temperature

  • Author

    Toulon, Gaetan ; Bourennane, A. ; Isoird, K.

  • Author_Institution
    LAAS, Toulouse, France
  • Volume
    60
  • Issue
    11
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    3814
  • Lastpage
    3820
  • Abstract
    In high current, high voltage, high temperature power applications, commercially available conventional silicon thyristors are not suited because they present high leakage current. In this context, this paper presents a high-symmetrical (voltage) thyristor structure that presents a lower leakage current and higher breakover voltage as compared with the conventional thyristor at. It is shown through 2-D physical simulations that the replacement of the P-emitter of a standard symmetrical thyristor by a judicious association of P diffusions and Schottky contacts at the anode side contributes to the reduction of the leakage current in the forward blocking state at high temperature. A fine tune of the anode side configuration will improve the forward OFF-state behavior with only a negligible ON-state voltage drop degradation. Moreover, the comparison with the conventional anode short thyristor shows that the insertion of Schottky contacts leads to the same improvements in terms of OFF-state forward breakover voltage and leakage current and also presents a high reverse blocking voltage.
  • Keywords
    Schottky barriers; circuit optimisation; circuit simulation; diffusion; leakage currents; thyristors; 2-D physical simulations; P diffusions; backside Schottky contacts; breakover voltage; forward OFF-state behavior; forward blocking state; high temperature; high-symmetrical thyristor structure; leakage current; optimization; Anodes; Cathodes; Leakage currents; Schottky barriers; Temperature; Thyristors; Transistors; High temperature; Schottky contacts; high voltage thyristor; pulsed power; technological computer aided design (TCAD) simulations;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2280554
  • Filename
    6609056