DocumentCode
25057
Title
Analysis and Optimization of a Thyristor Structure Using Backside Schottky Contacts Suited for the High Temperature
Author
Toulon, Gaetan ; Bourennane, A. ; Isoird, K.
Author_Institution
LAAS, Toulouse, France
Volume
60
Issue
11
fYear
2013
fDate
Nov. 2013
Firstpage
3814
Lastpage
3820
Abstract
In high current, high voltage, high temperature power applications, commercially available conventional silicon thyristors are not suited because they present high leakage current. In this context, this paper presents a high-symmetrical (voltage) thyristor structure that presents a lower leakage current and higher breakover voltage as compared with the conventional thyristor at. It is shown through 2-D physical simulations that the replacement of the P-emitter of a standard symmetrical thyristor by a judicious association of P diffusions and Schottky contacts at the anode side contributes to the reduction of the leakage current in the forward blocking state at high temperature. A fine tune of the anode side configuration will improve the forward OFF-state behavior with only a negligible ON-state voltage drop degradation. Moreover, the comparison with the conventional anode short thyristor shows that the insertion of Schottky contacts leads to the same improvements in terms of OFF-state forward breakover voltage and leakage current and also presents a high reverse blocking voltage.
Keywords
Schottky barriers; circuit optimisation; circuit simulation; diffusion; leakage currents; thyristors; 2-D physical simulations; P diffusions; backside Schottky contacts; breakover voltage; forward OFF-state behavior; forward blocking state; high temperature; high-symmetrical thyristor structure; leakage current; optimization; Anodes; Cathodes; Leakage currents; Schottky barriers; Temperature; Thyristors; Transistors; High temperature; Schottky contacts; high voltage thyristor; pulsed power; technological computer aided design (TCAD) simulations;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2280554
Filename
6609056
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