• DocumentCode
    2505782
  • Title

    Measurement and analysis of packages with differential signaling scheme

  • Author

    Penkar, Amey ; Caggiano, Michael

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
  • fYear
    2003
  • fDate
    8-11 May 2003
  • Firstpage
    452
  • Lastpage
    455
  • Abstract
    The characterization of packages with differential input lines involves the implementation of mixed mode S-parameters based on the even and odd modes of propagation. The device under test is a 100 I/O quad flat package with a differential signaling scheme. Under simplified assumptions of uncoupled transmission test system, this analysis can be performed using the conventional vector network analyzer and specially designed calibration and test fixtures; making use of conversion equations from a single mode measurement to a mixed mode calculation. The calibration is a standard "short open load thru" (SOLT) calibration, with specially designed fixtures to de-embed the effects of the test network used. Consideration is given to the co-efficients of calibration as expected frequency of operation extends up to 26GHz at which the parasitics of the vias are suspected to cause some distortion. The test fixture is the unpowered IC under consideration that has an unpowered terminal impedance of 52 ohms. With the provisions above, a comprehensive model of the package can be determined.
  • Keywords
    S-parameters; calibration; integrated circuit packaging; integrated circuit testing; network analysers; I/O quad flat package; IC; SOLT calibration; conversion equation; device under test; mixed mode S-parameters; mixed mode calculation; short open load thru calibration; signaling scheme; single mode measurement; transmission test system; vector network analyzer; Calibration; Equations; Fixtures; Frequency; Packaging; Performance analysis; Performance evaluation; Scattering parameters; Signal analysis; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
  • Print_ISBN
    0-7803-8002-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2003.1260571
  • Filename
    1260571