DocumentCode :
2505789
Title :
Extraction method of multiline parameters for printed circuit board interconnects
Author :
Wee, Jae-Kyung ; Kim, Yong-Ju ; Yoon, Han-Sub ; Lee, Seongsoo ; Moon, Gyu
Author_Institution :
Div. of Inf. & Comput. Sci., Hallym Univ., Kangwon, South Korea
fYear :
2002
fDate :
21-23 Oct. 2002
Firstpage :
127
Lastpage :
130
Abstract :
This paper proposes a modified technique for extracting electrical parameters of transmission lines on printed circuit boards (PCBs). This approach results in the generation of a hybrid measurement technique that is used in conjunction with TDR (time domain reflectometry) measurement in the time domain, S-parameter measurement in the frequency domain, and empirical design data, to obtain realistic consideration points for future PCB design. While the conventional methods cover parameter extraction of a single line, this proposed method can be extended to that of multi-coupled lines.
Keywords :
S-parameters; coupled transmission lines; frequency-domain analysis; high-frequency transmission line measurement; high-frequency transmission lines; interconnections; multiconductor transmission lines; printed circuit design; printed circuit testing; time-domain reflectometry; PCB interconnect multi-line parameter extraction method; frequency domain S-parameter measurements; hybrid measurement techniques; multi-coupled lines; single line parameter extraction; time domain reflectometry measurements; transmission line electrical parameter extraction; Data mining; Distributed parameter circuits; Frequency measurement; Hybrid power systems; Integrated circuit interconnections; Measurement techniques; Printed circuits; Reflectometry; Time measurement; Transmission line measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
Type :
conf
DOI :
10.1109/EPEP.2002.1057898
Filename :
1057898
Link To Document :
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