Title :
Lateral motion of bubbles from surfaces with mini ratchet topography modifications during pool boiling- experiments and preliminary model
Author :
Kapsenberg, Florian ; Thiagarajan, Naveenan ; Narayanan, Vinod ; Bhavnani, Sushil
Author_Institution :
Sch. of Mech. Ind. & Manuf. Eng., Oregon State Univ., Corvallis, OR, USA
fDate :
May 30 2012-June 1 2012
Abstract :
A means to passively effect liquid motion parallel to the surface through surface modifications is presented. The geometry considered is that of repeated array of silicon ratchets with reentrant cavities located on the shallow face of each ratchet. The surface is heated on the bottom side using a thin-film serpentine heater. Experiments were performed using deionized water at atmospheric pressures and subcoolings of 5°C and 20°C. High-speed videos were used to resolve bubble behavior near the surface. A preferential non-vertical bubble growth and departure direction was observed for both subcooling conditions. Tracking of bubbles was accomplished using a custom algorithm, which resolved instantaneous component of velocity of bubbles parallel to the surface in excess of 600 mm/s immediately following departure in the high subcooling condition. Mean horizontal component of velocities of bubbles farther from the surface, which were tracking the liquid velocity, were resolved in the range of 25 and 35 mm/s. A semi-empirical model based on bubble growth is presented to predict the observed liquid velocities.
Keywords :
boiling; bubbles; cooling; silicon; thermal management (packaging); bubbles; deionized water; lateral motion; liquid motion; liquid velocity; mean horizontal component; miniratchet topography modification; nonvertical bubble growth; pool boiling; reentrant cavities; silicon ratchet; subcooling condition; surface modification; temperature 20 C; temperature 5 C; thin-film serpentine heater; Cavity resonators; Heating; Image resolution; Liquids; Surface topography; Uncertainty; Vectors; microstructured surface; passive pumping; phase-change heat transfer; reentrant cavities; thermal management;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231427