Title :
Validation of frequency-dependent, lossy transmission line simulations for printed circuit boards
Author :
Heckmann, David L. ; Timpane, Trevor J.
Author_Institution :
Dept. of Electr. Eng., North Dakota Univ., Grand Forks, ND, USA
Abstract :
Accurate interconnect modeling is crucial for signal integrity analysis. Simulation of frequency-dependent transmission lines plays a key role in any interconnect simulations. This paper presents simulation results from three separate transmission line circuit simulation algorithms. The results are compared with laboratory measurements for validation. Two of the three methods investigated show excellent agreement with laboratory measurements.
Keywords :
SPICE; circuit simulation; interconnections; printed circuit testing; printed circuits; transmission line theory; HSPICE; PowerSPICE; frequency-dependent lossy transmission line simulations; interconnect modeling; laboratory measurements; model validation; printed circuit boards; signal integrity analysis; transmission line circuit simulation algorithms; Circuit simulation; Circuit testing; Computational modeling; Distributed parameter circuits; Frequency dependence; Integrated circuit interconnections; Laboratories; Power transmission lines; Printed circuits; Propagation losses;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057903
