Title :
A new, efficient analytic expression for the impedance of a rectangular power plane
Author :
Park, Myun-Joo ; Lee, Jung-Joon ; Lee, Jae Joon ; Park, Sung Joo ; Yoon, Chil Nam ; So, Byung Se
Author_Institution :
Device Solution Network, Samsung Electron. Co., Gyeonggi, South Korea
Abstract :
A new, efficient analytic expression is presented for the impedance of a rectangular power plane. It is based on the waveguide model of the rectangular power plane and requires smaller number of modal terms in impedance calculation compared to the existing formula based on a cavity model.
Keywords :
electric impedance; packaging; power electronics; waveguide theory; analytic expression; electronic packages; impedance calculation; modal terms; rectangular power plane; waveguide model; Boundary conditions; Electromagnetic analysis; Electromagnetic waveguides; Frequency; Green´s function methods; Impedance; Magnetic separation; Planar waveguides; Power system modeling; Rectangular waveguides;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057906
