DocumentCode
2505950
Title
A new, efficient analytic expression for the impedance of a rectangular power plane
Author
Park, Myun-Joo ; Lee, Jung-Joon ; Lee, Jae Joon ; Park, Sung Joo ; Yoon, Chil Nam ; So, Byung Se
Author_Institution
Device Solution Network, Samsung Electron. Co., Gyeonggi, South Korea
fYear
2002
fDate
21-23 Oct. 2002
Firstpage
163
Lastpage
166
Abstract
A new, efficient analytic expression is presented for the impedance of a rectangular power plane. It is based on the waveguide model of the rectangular power plane and requires smaller number of modal terms in impedance calculation compared to the existing formula based on a cavity model.
Keywords
electric impedance; packaging; power electronics; waveguide theory; analytic expression; electronic packages; impedance calculation; modal terms; rectangular power plane; waveguide model; Boundary conditions; Electromagnetic analysis; Electromagnetic waveguides; Frequency; Green´s function methods; Impedance; Magnetic separation; Planar waveguides; Power system modeling; Rectangular waveguides;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location
Monterey, CA, USA
Print_ISBN
0-7803-7451-7
Type
conf
DOI
10.1109/EPEP.2002.1057906
Filename
1057906
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