DocumentCode
2505963
Title
Analysis of via distribution effect on multi-layered power/ground transfer impedance of high-performance packages
Author
Kim, HvunPsoo ; Kim, Jingook ; Jeong, Youchul ; Park, Jongbae ; Kim, Joungho
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea
fYear
2002
fDate
21-23 Oct. 2002
Firstpage
171
Lastpage
174
Abstract
The effect of via distribution on multi-layer power/ground network of high-performance packages is thoroughly analyzed. Depending on the via distribution, the effective impedance of the power/ground network is extracted from the S-parameter measurement.
Keywords
S-parameters; ball grid arrays; earthing; electric impedance; integrated circuit packaging; modelling; power electronics; BGA; PGA package; S-parameter measurement; effective impedance extraction; high-performance packages; microprocessor packages; model parameter extraction; multi-layer power/ground network; multi-layered power/ground transfer impedance; pin-grid array package; via distribution; Capacitance measurement; Electronics packaging; Frequency; Impedance measurement; Inductance; Laboratories; Power measurement; Scattering parameters; Submillimeter wave technology; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location
Monterey, CA, USA
Print_ISBN
0-7803-7451-7
Type
conf
DOI
10.1109/EPEP.2002.1057908
Filename
1057908
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