Measurement methods for curing properties of resin considering process condition

The authors have found that the Young´s Modulus and the shrinkage behavior of the packaging resin are greatly affected by the constraint condition, especially during the curing process. The purposes of this study are to propose the measuring method of property of the resin considering the process condition and to verify the results from experimental and analytical models. Therefore, it has been understood to have to use the curing property with considering the real packaging conditions.