A methodology for optimizing the selection of decoupling components for power delivery systems of high-performance ASICs

Author

Beker, Benjamin ; Wallace, Doug

Author_Institution

Adv. Micro Devices Inc., Austin, TX, USA

fYear

2002

fDate

21-23 Oct. 2002

Firstpage

195

Lastpage

198

Abstract

This paper describes an approach for optimizing the selection of de-coupling components for the power delivery network of a high-performance ASIC package. The proposed approach is aimed at reducing the guess-work that is typically associated with the design of an appropriate de-coupling scheme, which meets desired performance targets. It is partly based on constructing a distributed circuit model of the entire power delivery system (package and board) with sufficient spatial (and frequency) resolution, supplemented by exploiting the simple concepts of resonant circuit characteristics over a desired frequency band. The application of the methodology is illustrated for a high-end ASIC package, which has limited package-level and board-level resources.

Keywords

RLC circuits; application specific integrated circuits; capacitors; circuit noise; circuit optimisation; circuit resonance; circuit simulation; integrated circuit design; integrated circuit modelling; integrated circuit packaging; power supply circuits; printed circuit design; transient response; ASIC decoupling component selection optimization; decoupling capacitors; decoupling schemes; high-end ASIC package-level/board-level resources; high-performance ASIC power delivery systems; model spatial/frequency resolution; package/board distributed circuit models; parallel resonant circuit RCL parameters; power delivery networks; power supply noise; resonant circuit frequency band; transient response; Application specific integrated circuits; Capacitors; Frequency; Impedance; Microprocessors; Optimization methods; Packaging; Power supplies; Power system modeling; RLC circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-7451-7

Type

conf

DOI

10.1109/EPEP.2002.1057914

Filename

1057914