Title :
Thermal metrology techniques for UV LED light sources
Author :
Natarajan, Shweta ; Habtemichael, Yishak ; Graham, Samuel
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
May 30 2012-June 1 2012
Abstract :
In this study, we highlight the use of micro-Raman spectroscopy to measure vertical temperature gradients within Light Emitting Diodes (LEDs), ranging from the temperature of the growth substrate, the temperature of regions adjacent to the MQWs, as well as the p-GaN contact layer adjacent to the p-contact metallization. Depth-sensitive micro-Raman temperature measurements are compared with IR spectroscopy temperature measurements, for two types of device architectures. It was found that the temperature rises of the interior layers of the device are higher than those measured by IR thermography. Device peak temperatures shown by IR thermography are also compared to peak temperatures from a thermal finite element analysis (FEA) model for one type of device architecture and were found to agree closely. This study focuses mainly on the thermometry and thermal analysis of Ultraviolet Light Emitting Diodes (UV LEDs) with some additional discussion on blue LEDs.
Keywords :
III-V semiconductors; Raman spectra; gallium arsenide; infrared imaging; infrared spectra; infrared spectroscopy; light emitting diodes; light sources; measurement; metallisation; GaN; IR spectroscopy temperature measurements; IR thermography; UV LED light source; depth-sensitive micro-Raman temperature measurements; device architecture; growth substrate; light emitting diode; micro-Raman spectroscopy; p-GaN contact layer; p-contact metallization; thermal finite element analysis model; thermal metrology technique; ultraviolet light emitting diode; vertical temperature gradient; Geometry; Light emitting diodes; Quantum well devices; Spectroscopy; Substrates; Temperature; Temperature measurement; Finite Element Analysis; Infrared Spectroscopy; Raman Spectroscopy; UV LEDs;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2012.6231446