DocumentCode :
2506379
Title :
Simulating complex power-ground plane shapes with variable-size cell SPICE grids
Author :
Novak, Istvan ; Miller, Jason R. ; Blomberg, Eric
Author_Institution :
SUN Microsystems Inc., Burlington, MA, USA
fYear :
2002
fDate :
21-23 Oct. 2002
Firstpage :
265
Lastpage :
268
Abstract :
Power and ground planes can be simulated with rectangular uniform SPICE grids, or by analytically evaluating the double series of modal resonances. For nonrectangular shapes, the Transmission Matrix Method (TLM) can be used. For odd shapes, irregular outlines, cutouts and perforations, a variable-size cell grid is shown to be effective and sufficiently accurate. The adaptive grid preserves the static capacitance of the planes, calculates the modal resonances accurately in the presence of cutouts, and can also account for the perforations of planes.
Keywords :
SPICE; capacitance; earthing; packaging; power electronics; adaptive grid; complex power-ground plane shapes; modal resonances; nonrectangular shapes; perforated planes; rectangular uniform SPICE grids; static capacitance; variable-size cell SPICE grids; Capacitance; Capacitors; Electronic mail; Impedance; Resonance; Resonant frequency; Runtime; SPICE; Shape; Sun;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
Type :
conf
DOI :
10.1109/EPEP.2002.1057929
Filename :
1057929
Link To Document :
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