DocumentCode
2506379
Title
Simulating complex power-ground plane shapes with variable-size cell SPICE grids
Author
Novak, Istvan ; Miller, Jason R. ; Blomberg, Eric
Author_Institution
SUN Microsystems Inc., Burlington, MA, USA
fYear
2002
fDate
21-23 Oct. 2002
Firstpage
265
Lastpage
268
Abstract
Power and ground planes can be simulated with rectangular uniform SPICE grids, or by analytically evaluating the double series of modal resonances. For nonrectangular shapes, the Transmission Matrix Method (TLM) can be used. For odd shapes, irregular outlines, cutouts and perforations, a variable-size cell grid is shown to be effective and sufficiently accurate. The adaptive grid preserves the static capacitance of the planes, calculates the modal resonances accurately in the presence of cutouts, and can also account for the perforations of planes.
Keywords
SPICE; capacitance; earthing; packaging; power electronics; adaptive grid; complex power-ground plane shapes; modal resonances; nonrectangular shapes; perforated planes; rectangular uniform SPICE grids; static capacitance; variable-size cell SPICE grids; Capacitance; Capacitors; Electronic mail; Impedance; Resonance; Resonant frequency; Runtime; SPICE; Shape; Sun;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location
Monterey, CA, USA
Print_ISBN
0-7803-7451-7
Type
conf
DOI
10.1109/EPEP.2002.1057929
Filename
1057929
Link To Document