• DocumentCode
    2506379
  • Title

    Simulating complex power-ground plane shapes with variable-size cell SPICE grids

  • Author

    Novak, Istvan ; Miller, Jason R. ; Blomberg, Eric

  • Author_Institution
    SUN Microsystems Inc., Burlington, MA, USA
  • fYear
    2002
  • fDate
    21-23 Oct. 2002
  • Firstpage
    265
  • Lastpage
    268
  • Abstract
    Power and ground planes can be simulated with rectangular uniform SPICE grids, or by analytically evaluating the double series of modal resonances. For nonrectangular shapes, the Transmission Matrix Method (TLM) can be used. For odd shapes, irregular outlines, cutouts and perforations, a variable-size cell grid is shown to be effective and sufficiently accurate. The adaptive grid preserves the static capacitance of the planes, calculates the modal resonances accurately in the presence of cutouts, and can also account for the perforations of planes.
  • Keywords
    SPICE; capacitance; earthing; packaging; power electronics; adaptive grid; complex power-ground plane shapes; modal resonances; nonrectangular shapes; perforated planes; rectangular uniform SPICE grids; static capacitance; variable-size cell SPICE grids; Capacitance; Capacitors; Electronic mail; Impedance; Resonance; Resonant frequency; Runtime; SPICE; Shape; Sun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
  • Conference_Location
    Monterey, CA, USA
  • Print_ISBN
    0-7803-7451-7
  • Type

    conf

  • DOI
    10.1109/EPEP.2002.1057929
  • Filename
    1057929