• DocumentCode
    2506384
  • Title

    Application of coherent resonant tunnelling theory in GaAs RTD fabrication

  • Author

    Wu, Yibin ; Yang, Ruixia ; Yang, Kewu ; Shang, Yaohui ; Bu, Xiazheng ; Niu, Chenliang ; Zhao, Hui ; Wang, Jianfeng

  • Author_Institution
    Nat. Key Lab. of ASIC, Shijiazhuang, China
  • fYear
    2010
  • fDate
    10-11 May 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Resonant tunnelling transmission coefficient FWHM (full width at half-maximum) curves of GaAs/AlAs/ In0.1Ga0.9As double-barrier structures are computed and illustrated, and the distribution of these curves clearly show the main physical mechanism of RTD (resonant tunnelling diode) and the route of design to desired RTD´s features. As example, several RTD epi-layer structures are worked out with above curves and are grown by molecular beam epitaxy method. X-ray layer thickness measurement results of these structures are exactly identical with the design data, and also the interfaces are very flat. The devices are fabricated, and the I-V features are characterized. These I-V data of our samples demonstrate a good corresponding relation to the curves and typical peak-to-valley current ratio (PVCR) reaching 8.25 with peak current density 112KA/cm2.
  • Keywords
    gallium arsenide; molecular beam epitaxial growth; resonant tunnelling diodes; thickness measurement; GaAs; GaAs RTD fabrication; RTD epilayer structures; X-ray layer thickness measurement; coherent resonant tunnelling theory; double-barrier structures; molecular beam epitaxy; peak current density; resonant tunnelling diode; resonant tunnelling transmission coefficient FWHM curves; Application specific integrated circuits; Digital integrated circuits; Diodes; Fabrication; Gallium arsenide; Integrated circuit technology; Manufacturing industries; Molecular beam epitaxial growth; Resonant tunneling devices; Wave functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2010 International Workshop on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5866-0
  • Type

    conf

  • DOI
    10.1109/IWJT.2010.5474905
  • Filename
    5474905