• DocumentCode
    2506501
  • Title

    A simulation study of SOI RESURF junctions for HV LDMOS (>600V)

  • Author

    Wang, Yanying ; Zhang, Dong ; Lv, Yuqiang ; Gong, Dawei ; Shao, Kai ; Wang, Zhongjian ; He, Dawei ; Cheng, Xinhong

  • Author_Institution
    Technol. Dev. Dept., Adv. Semicond. Manuf. Corp. Ltd., China
  • fYear
    2010
  • fDate
    10-11 May 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    HV LDMOS on SOI has found wide applications such as lighting electronics and motor control due to its advantages over conventional LDMOS on bulk silicon. However, the design of optimized junctions with high breakdown voltages is commonly recognized to be difficult. This is partly because of the lack of analytical knowledge for the junctions design. In this study, various junctions were simulated by TCAD and analyzed from semiconductor physics point of view. It includes not only the junctions showing high breakdown voltages (>600V) but also the junctions showing relatively low breakdown voltages. The electrical field distribution, electrostatic potential distribution, depletion region and mobile carriers etc. were compared and analyzed to explain the reasons why a high breakdown voltage can be achieved for some junctions. Additionally, the breakdown voltage dependence on drift region doping profile was also studied.
  • Keywords
    MOSFET; semiconductor junctions; silicon-on-insulator; technology CAD (electronics); HV LDMOS; SOI RESURF junction; TCAD; breakdown voltage; bulk silicon; depletion region; electrical field distribution; electrostatic potential distribution; lighting electronics; mobile carriers; motor control; optimized junction design; semiconductor physics; Breakdown voltage; Design optimization; Doping profiles; Electrostatic analysis; Motor drives; Nonuniform electric fields; Semiconductor device manufacture; Silicon on insulator technology; Surface resistance; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2010 International Workshop on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5866-0
  • Type

    conf

  • DOI
    10.1109/IWJT.2010.5474910
  • Filename
    5474910