• DocumentCode
    2506504
  • Title

    Impact of Phase Noise on OFDM and SC-CP

  • Author

    Zamorano, J.L. ; Nsenga, J. ; Thillo, W. Van ; Bourdoux, A. ; Horlin, F.

  • Author_Institution
    IMEC, Heverlee
  • fYear
    2007
  • fDate
    26-30 Nov. 2007
  • Firstpage
    3822
  • Lastpage
    3825
  • Abstract
    Single-carrier with cyclic prefix (SC-CP) is seen as an interesting air interface to replace orthogonal frequency- division multiplexing (OFDM) because it features a lower peak- to average power ratio (PAPR) while still allowing low complexity frequency domain equalization (FDE). Both air interfaces are highly sensitive to phase noise (PN) that degrades their system performances. In this paper, we study and compare analytically the PN impact on both air interfaces. Simulations are also carried out to validate the analytical results. PN causes the same common phase error (CPE) on both air interfaces, as well as it leads to Inter-Carrier Interference (ICI) in OFDM and inter-symbol interference (ISI) in SC-CP. However OFDM is found to be slightly less affected than SC-CP in both flat channels and frequency selective channels. It is shown also that CPE is the dominate impact if the PN cut-off frequency is smaller than the subcarrier spacing.
  • Keywords
    OFDM modulation; equalisers; intercarrier interference; intersymbol interference; phase noise; wireless channels; FDE; ICI; OFDM; PN cut-off frequency; SC-CP; common phase error; flat channels; frequency domain equalization; frequency selective channels; inter-carrier interference; inter-symbol interference; orthogonal frequency-division multiplexing; peak-to-average power ratio; phase noise; single-carrier with cyclic prefix; subcarrier spacing; AWGN; Additive white noise; Bit error rate; Degradation; Frequency domain analysis; Interference; OFDM; Peak to average power ratio; Phase noise; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Global Telecommunications Conference, 2007. GLOBECOM '07. IEEE
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-1042-2
  • Electronic_ISBN
    978-1-4244-1043-9
  • Type

    conf

  • DOI
    10.1109/GLOCOM.2007.726
  • Filename
    4411636