Title :
Non-destructive S-parameter measurement of a hermetically encapsulated package with comparison to high-frequency simulation
Author :
Pfeiffer, Ullrich ; Schuster, Christian
Abstract :
A novel methodology is presented for non-destructive S-parameter measurement of hermetically encapsulated packages using an on-chip programmable termination network and a port reduction method. Measured results for a QFN package are compared to simulations.
Keywords :
S-parameters; circuit simulation; crosstalk; encapsulation; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; IC electromagnetic package effects; QFN packages; crosstalk; hermetical sealing; hermetically encapsulated packaging; nondestructive S-parameter measurement; on-chip programmable termination networks; package HF simulation; package characterization; port reduction methods; Bonding; Electric variables measurement; Electronics packaging; Grounding; Hermetic seals; Scattering parameters; Semiconductor device measurement; Semiconductor device packaging; Testing; Time measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7451-7
DOI :
10.1109/EPEP.2002.1057942
