DocumentCode :
2506650
Title :
Performance of an air-cooled heat sink with microscale dimples under transitional flow conditions
Author :
Kota, Krishna ; Burton, Ludovic ; Joshi, Yogendra
Author_Institution :
Microelectron. & Emerging Technol. Thermal Lab., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2012
fDate :
May 30 2012-June 1 2012
Firstpage :
450
Lastpage :
456
Abstract :
The objective of this effort is to pursue artificial microscale surface roughness features in the form of dimples, on the fins of an air cooled heat sink, as a passive option to energy-efficiently augment heat transfer in forced convection flows. High fidelity numerical simulations were employed for realizing an optimized dimple configuration and to comprehend the behavior of micro-sized dimples under high velocity (~17 m/s) transitional flow conditions. Fully developed flow simulations were performed, and design of experiments with response surface methodology was employed for the numerical optimization. The results showed up to 30% heat transfer improvement in the fully developed region compared to a smooth finned channel. Experiments were also carried out to assess the performance of the aforementioned optimized configuration in a custom built setup in the laboratory, which showed up to 10.5% heat transfer improvement over a corresponding smooth-walled channel. The results showed that application-specific optimization of dimples is crucial. With further exploration of shape and design parameters, dimples might have the potential to improve thermal performance passively and form an attractive candidate to realize high-performance air-cooled heat sinks in the future.
Keywords :
channel flow; cooling; flow simulation; forced convection; heat sinks; numerical analysis; optimisation; response surface methodology; surface roughness; air-cooled heat sink; application-specific optimization; artificial microscale surface roughness; energy-efficiently augment heat transfer; flow simulations; forced convection flows; heat transfer; high fidelity numerical simulations; microscale dimples; microsized dimples; numerical optimization; response surface methodology; smooth-walled channel; transitional flow conditions; Computational modeling; Heat sinks; Heat transfer; Numerical models; Numerical simulation; Response surface methodology; Temperature measurement; Passive heat transfer enhancement; air cooling; design of experiments; design optimization; microscale dimples; periodic flow; response surface methodology; transitional flow;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
978-1-4244-9533-7
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2012.6231466
Filename :
6231466
Link To Document :
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